PHOTONA weekly dispatch decoding photonic IC breakthroughs, silicon photonics earnings, and optical interconnect benchmarks — for the engineers and investors building on it.
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Subscribe freeIMEC-benchmarked fab data shows edge-coupled grating yield surpassing foundry SLA by 6.1 points — a structural inflection for merchant transceiver economics.
Optical matrix-multiply at 64×64 tile granularity delivers 3.4× energy efficiency on attention layers. Memory-bandwidth bottleneck remains the limiting variable.
First co-packaged optical I/O reaching sub-2 pJ/bit in silicon — 8× lower than copper SerDes at equivalent bandwidth density. Hyperscaler NDA evaluations confirmed.
Optical compute for AI inference — led by Google Ventures
Low-loss edge coupler with inverse taper geometry for 220nm SOI
Co-packaged optics for HPC — NVIDIA participation confirmed
Monolithic photonic-electronic integration via backside illumination
Ring resonator thermal compensation using on-chip micro-heater arrays
Photonic fabric for disaggregated memory — hyperscaler evaluation phase
From cleanroom fab engineers to AI accelerator architects — the people building light-speed compute read Photon.
Co-packaged vs. pluggable at 200G per lane — fab economics, power envelopes, and which architecture wins the hyperscaler rack by 2027.
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